{"created":"2023-06-20T16:51:13.048140+00:00","id":23886,"links":{},"metadata":{"_buckets":{"deposit":"c825f011-a580-4c21-b5e6-0b5c0c24e951"},"_deposit":{"created_by":3,"id":"23886","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"23886"},"status":"published"},"_oai":{"id":"oai:kindai.repo.nii.ac.jp:00023886","sets":["14:923:2405:4872"]},"author_link":["44647","44648"],"item_2_biblio_info_21":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2023-03-15","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"16","bibliographicPageEnd":"6","bibliographicPageStart":"5","bibliographic_titles":[{"bibliographic_title":"近畿大学工業高等専門学校研究紀要"},{"bibliographic_title":"Research reports Kindai University Technical College","bibliographic_titleLang":"en"}]}]},"item_2_description_33":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Stamping is suitable method for mass production because it is able to shaping materials in an instant. However, there are uncontrolled slight gaps between the workpiece and dies. Therefore, processing with high-precision is difficult. Gaps between the workpiece and dies can be detected by ultrasonic waves. And in order to detect the gaps, it is necessary to apply a contact medium between the dies or the die and the workpiece, because the ultrasonic wave becomes easier propagate. In this time, we investigated the relation of type of contact medium and the propagation efficiency of ultrasonic waves.","subitem_description_type":"Abstract"}]},"item_2_description_41":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_2_publisher_14":{"attribute_name":"出版者 名前","attribute_value_mlt":[{"subitem_publisher":"近畿大学工業高等専門学校"}]},"item_2_source_id_22":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"18824374","subitem_source_identifier_type":"ISSN"}]},"item_2_text_7":{"attribute_name":"著者(英)","attribute_value_mlt":[{"subitem_text_language":"en","subitem_text_value":"KIOKA, Keitaro"},{"subitem_text_language":"en","subitem_text_value":"HAGINO, Naoto"}]},"item_2_text_8":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"近畿大学工業高等専門学校 総合システム工学科 機械システムコース"},{"subitem_text_value":"神奈川工科大学工学部機械工学科"}]},"item_2_text_9":{"attribute_name":"著者所属(翻訳)","attribute_value_mlt":[{"subitem_text_value":"Kindai University Technical College"}]},"item_2_version_type_12":{"attribute_name":"版","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_be7fb7dd8ff6fe43","subitem_version_type":"NA"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"木岡, 桂太郎"},{"creatorName":"キオカ, ケイタロウ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"萩野, 直人"},{"creatorName":"ハギノ, ナオト","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2023-05-08"}],"displaytype":"detail","filename":"AA12315376-20230315-0005.pdf","filesize":[{"value":"396.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"AA12315376-20230315-0005.pdf","url":"https://kindai.repo.nii.ac.jp/record/23886/files/AA12315376-20230315-0005.pdf"},"version_id":"4a6b9614-e96a-45cf-861a-dafad341cb0c"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Stamping","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Ultrasonic wave detection","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Contact medium","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"プレス加工におけるインプロセスモニタリング－超音波の検出強度に関する接触媒質の影響－","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"プレス加工におけるインプロセスモニタリング－超音波の検出強度に関する接触媒質の影響－"},{"subitem_title":"In-process monitoring in stamping －Effect of contact medium on ultrasonic wave detection intensity－","subitem_title_language":"en"}]},"item_type_id":"2","owner":"3","path":["4872"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-05-08"},"publish_date":"2023-05-08","publish_status":"0","recid":"23886","relation_version_is_last":true,"title":["プレス加工におけるインプロセスモニタリング－超音波の検出強度に関する接触媒質の影響－"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-06-20T18:42:30.009781+00:00"}