{"created":"2023-06-20T16:49:19.437455+00:00","id":21521,"links":{},"metadata":{"_buckets":{"deposit":"8b373ef9-5697-41b9-977f-be849c5a972a"},"_deposit":{"created_by":3,"id":"21521","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"21521"},"status":"published"},"_oai":{"id":"oai:kindai.repo.nii.ac.jp:00021521","sets":["14:2667:4613"]},"author_link":["30563"],"control_number":"21521","item_8_biblio_info_21":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2020","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"9","bibliographicPageStart":"1","bibliographic_titles":[{"bibliographic_title":"科学研究費助成事業研究成果報告書 (2019)"}]}]},"item_8_description_25":{"attribute_name":"リンクURL","attribute_value_mlt":[{"subitem_description":"https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-17K06097/","subitem_description_type":"Other"}]},"item_8_description_33":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"研究成果の概要(和文):Ni基合金とC/C材の高品位異材接合を応力緩和層としてレーザ式粉体床溶融法(PBF-LB)により造形した多孔質体を挿入してNi基ろう材を用いて異材ろう付継手を得た。その研究過程でPBF-LBで可能な造形精度の確認のために溶融凝固現象を加味したPBF-LB過程を模擬する数値計算法を開発し,最小厚さをスポット径の2倍程度と見積もった。Ni基ろう材のCTE値を100-1100℃の範囲で測定しろう付継手強度予測の基礎データを得た。また,PBF-LB過程中の粉体床温度変化すが造形条件の修正を必要とするほど大きいことを明らかにした。研究成果の概要(英文):A dissimilar material joint between a Ni-based alloy and a C/C composites was obtained using a Ni-based brazing filler alloy by inserting a porous interlayer fabricated by the laser powder bed fusion (PBF-LB), which was expected to relief the residual stress. In the course of the research, a numerical calculation method was developed to simulate the PBF-LB process considering the melt solidification phenomenon in order to confirm the modeling accuracy possible with PBF-LB, and the minimum thickness was estimated to be about twice the laser spot diameter. The CTE value of Ni-based brazing material was measured in the range of 100-1100 °C to obtain basic data for brazing joint strength prediction. It was also clarified that the change in the powder bed temperature during the PBF-LB process was large enough to require modification of the molding conditions.","subitem_description_type":"Abstract"}]},"item_8_description_36":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"研究種目:基盤研究(C); 研究期間:2017~2019; 課題番号:17K06097; 研究分野:接合工学; 科研費の分科・細目:","subitem_description_type":"Other"}]},"item_8_description_37":{"attribute_name":"資源タイプ(WEKO2)","attribute_value_mlt":[{"subitem_description":"Research Paper","subitem_description_type":"Other"}]},"item_8_description_41":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_8_publisher_14":{"attribute_name":"出版者 名前","attribute_value_mlt":[{"subitem_publisher":"近畿大学"}]},"item_8_text_10":{"attribute_name":"著者 役割","attribute_value_mlt":[{"subitem_text_value":"研究代表者"}]},"item_8_text_7":{"attribute_name":"著者(英)","attribute_value_mlt":[{"subitem_text_language":"en","subitem_text_value":"Ikeshoji, Toshi-Taka"}]},"item_8_text_8":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"近畿大学次世代基盤技術研究所; 特任准教授"}]},"item_8_text_9":{"attribute_name":"著者所属(翻訳)","attribute_value_mlt":[{"subitem_text_value":"Kindai University"}]},"item_8_version_type_12":{"attribute_name":"版","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_be7fb7dd8ff6fe43","subitem_version_type":"NA"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"池庄司, 敏孝"},{"creatorName":"イケショウジ, トシタカ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2021-03-15"}],"displaytype":"detail","filename":"17K06097seika.pdf","filesize":[{"value":"676.1 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"17K06097seika.pdf","url":"https://kindai.repo.nii.ac.jp/record/21521/files/17K06097seika.pdf"},"version_id":"a3c3f939-47e2-4a1c-ac99-eb8bb122576c"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"付加製造","subitem_subject_scheme":"Other"},{"subitem_subject":"パウダーベッド","subitem_subject_scheme":"Other"},{"subitem_subject":"ニッケル基合金","subitem_subject_scheme":"Other"},{"subitem_subject":"異材接合","subitem_subject_scheme":"Other"},{"subitem_subject":"熱膨張係数","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"research report","resourceuri":"http://purl.org/coar/resource_type/c_18ws"}]},"item_title":"金属3D積層造形による低熱膨張多孔質体を応力緩和層とした高品位異材接合","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"金属3D積層造形による低熱膨張多孔質体を応力緩和層とした高品位異材接合","subitem_title_language":"ja"},{"subitem_title":"High quality dissimilar joining using stress relaxation insert layer of porous structure with low thermal expansion fabricated by metal additive manufacturing","subitem_title_language":"en"}]},"item_type_id":"8","owner":"3","path":["4613"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2021-03-15"},"publish_date":"2021-03-15","publish_status":"0","recid":"21521","relation_version_is_last":true,"title":["金属3D積層造形による低熱膨張多孔質体を応力緩和層とした高品位異材接合"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2023-09-14T07:26:20.111063+00:00"}