{"created":"2023-06-20T16:47:55.562640+00:00","id":19703,"links":{},"metadata":{"_buckets":{"deposit":"693fa30a-be0c-4e27-a904-fccc98b5500d"},"_deposit":{"created_by":3,"id":"19703","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"19703"},"status":"published"},"_oai":{"id":"oai:kindai.repo.nii.ac.jp:00019703","sets":["14:2667:4459"]},"author_link":["33454"],"item_8_biblio_info_21":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2018","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"4","bibliographicPageStart":"1","bibliographic_titles":[{"bibliographic_title":"科学研究費助成事業研究成果報告書 (2017)"}]}]},"item_8_description_33":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"研究成果の概要（和文）：太陽電池向け材料であるシリコン等のダメーシフリー切断加工を目的とした、新たな砥粒フリースライシング法の開発を行った。本加工法は、化学液を加工物に供給しながらワイヤで擦過を行うものであり、従来技術よりも切断幅（カーフロス）を低減させることができる。本研究では、開発技術における加工速度の向上、マルチワイヤ加工、加工物サイズのスケールアップ、フッ酸フリー加工の検討を行った。その結果、従来の機械加工法に比べて、加工速度に課題がみられたものの、より小さなカーフロスでマルチ加工を施すことが可能となった。毒性の高いフッ酸を使用しない加工法として、光ファイバを利用したエッチング法を開発した。\n研究成果の概要（英文）：Novel abrasive free slicing method for photovoltaic materials has been developed to achieve damage free wafer surface with a low kerf loss. In this method, a chemical etchant is supplied to the material and the material surface is abraded by a wire tool. In this research, studies to improve a material removal rate, to achieve multi-wire processing, to scale up the material size, and to reduce the use of HF solution has been conducted. Although the material removal rate remain an issue, the multi-wire processing with lower kerf loss has been achieved, compared with the conventional mechanical machining. Further, an etching method employing an UV-assisted etching with optical fiber has been developed without using HF solution.","subitem_description_type":"Abstract"}]},"item_8_description_36":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"研究種目：基盤研究(C);  研究期間：2015～2017;   課題番号：15K05736;   研究分野：精密加工;   科研費の分科・細目：","subitem_description_type":"Other"}]},"item_8_description_37":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"Research Paper","subitem_description_type":"Other"}]},"item_8_description_41":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_8_publisher_14":{"attribute_name":"出版者 名前","attribute_value_mlt":[{"subitem_publisher":"近畿大学"}]},"item_8_relation_11":{"attribute_name":"著者 外部リンク","attribute_value_mlt":[{"subitem_relation_name":[{"subitem_relation_name_text":"https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-15K05736/"}]}]},"item_8_text_10":{"attribute_name":"著者 役割","attribute_value_mlt":[{"subitem_text_value":"研究代表者"}]},"item_8_text_7":{"attribute_name":"著者(英)","attribute_value_mlt":[{"subitem_text_language":"en","subitem_text_value":"MURATA,Junji"}]},"item_8_text_8":{"attribute_name":"著者 所属","attribute_value_mlt":[{"subitem_text_value":"近畿大学理工学部; 准教授"}]},"item_8_text_9":{"attribute_name":"著者所属(翻訳)","attribute_value_mlt":[{"subitem_text_value":"Kindai University"}]},"item_8_version_type_12":{"attribute_name":"版","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_be7fb7dd8ff6fe43","subitem_version_type":"NA"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"村田, 順二"},{"creatorName":"ムラタ, ジュンジ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"33454","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"70531474","nameIdentifierScheme":"研究者番号","nameIdentifierURI":" "}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-11-20"}],"displaytype":"detail","filename":"15K05736seika.pdf","filesize":[{"value":"2.1 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"15K05736seika.pdf","url":"https://kindai.repo.nii.ac.jp/record/19703/files/15K05736seika.pdf"},"version_id":"12d71a26-cb9b-4e53-b0b6-9348bca90da3"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"切断加工","subitem_subject_scheme":"Other"},{"subitem_subject":"エッチング","subitem_subject_scheme":"Other"},{"subitem_subject":"太陽電池","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"research report","resourceuri":"http://purl.org/coar/resource_type/c_18ws"}]},"item_title":"低カーフロス・薄型太陽電池Ｓｉウェハを実現する触媒援用化学的スライシングの開発","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"低カーフロス・薄型太陽電池Ｓｉウェハを実現する触媒援用化学的スライシングの開発"},{"subitem_title":"Development of chemical slicing method for Photovaltaic materials with low ker-loss and thin wafer thickness","subitem_title_language":"en"}]},"item_type_id":"8","owner":"3","path":["4459"],"pubdate":{"attribute_name":"公開日","attribute_value":"2018-11-20"},"publish_date":"2018-11-20","publish_status":"0","recid":"19703","relation_version_is_last":true,"title":["低カーフロス・薄型太陽電池Ｓｉウェハを実現する触媒援用化学的スライシングの開発"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-06-20T21:34:00.277846+00:00"}